Interview Questions (Grab & Go)
- What is VLSI?
- What is an IC?
- Why Silicon is used for chips?
- Why Semiconductor material is used for electronic devices?
- What is a Wafer?
- What is a Die?
- What is an IP?
- Wafer vs Die vs Core vs IO Area (Pictorial View)
- What is an FPGA?
- What are the basic elements of FPGA?
- What is an ASIC?
- What is an ASSP?
- What are Standard Cells?
- What is the history of layout design?
- What are Parameterized Cells?
- What is Analog-On-Top (AOT) and Digital-On-Top (DOT) design flow?
- What are the different typical CMOS layers?
- Typical CMOS Layers (Pictorial View)
- MOSFET circuit symbol convention (Pictorial View)
- What are design rules and why we need them?
- What are Static and Scalable Design rules?
- Typical Design Rules (Pictorial View)
- What are enhancement and depletion type MOSFET?
- Custom IC Design Process Flow (Pictorial View)
- Evolution of CMOS technology in brief?
- What is a MOSFET?
- Why Polysilicon is used as Gate Material?
- What is a substrate in CMOS process?
- State Moore's Law? (One-liner)
- What does SPICE mean in VLSI? (One-liner)
- Why we are moving towards lower-nodes?
- What are Bond Wires?
- What is a Short-channel Effect?
- What is FSM and what are its types?
- Analog IC Design Process?
- Principle, Concept, Technique, Assumption
Please explain about memory architecture like write and read operation how it happens?
ReplyDeleteSure Vasanthi! I will try to include this in my upcoming posts.
DeleteThank you for your feedback.